Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics



Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics

G. Q. Zhang, L. J. Ernst, O. de Saint Leger




The organising and technical committees welcome the participants to the 2nd international conference on "Benefiting from Thermal and Mechanical Simulation in (Micro-) Electronics" (EuroSimE 2001) at Maison de la Chimie, Paris, France. The conference is organised by the thematic network COMPETE (www.compete.tm.fr) with major financial sponsoring by the EC, and technical co-sponsoring by IEEE CPMT and IUTAM.

As the only international conference specially dedicated to various mechanical and thermal issues in (micro-) electronics, EuroSimE2001 aims to:
- emphasis the fact that (micro-)electronics is becoming a major driven force and impulse for the further development of mechanics,
- draw attention from both academic societies and electronic industry for the significant impact of thermal and mechanical related issues on both the electronic industry and modern human life,
- demonstrate the state-of-the-art competencies and the challenges facing mechanics professionals,
- promote further research and development for mechanics of (micro-) electronics,
- promote further development and application of simulation & optimisation methodologies and tools for the electronics industry,

Titre Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics
Auteurs G. Q. Zhang, L. J. Ernst, O. de Saint Leger
Collection Ingéniérie
Langue anglais
Éditeur Europia productions
CLIL (Version 2013 ) 3069 TECHNIQUES ET SCIENCES APPLIQUEES
Date de première publication du titre 01 avril 2001
Subject Scheme Identifier Code      93 Thema subject category: T
Support Livre broché
Nb de pages
ISBN-10 2-7803-9806-X
ISBN-13 978-2-7803-9806-5
GTIN13 (EAN13) 9782780398065
Référence 113119-63
Date de publication 01 avril 2001
Format 21 x 30 x 2,4 cm
Poids 1030 gr
Prix 100,00 €
 
113119-63


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